THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. 15TH 2014. (EUROSIME 2014) (CD-ROM)

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022246
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  • Title: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014)
  • Date/Location: Held 7-9 April 2014, Ghent, Belgium.
  • IEEE #: CFP14566-CDR
  • ISBN: 9781479947911
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2014 )

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Tab 4

 
  • Title: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014)
  • Date/Location: Held 7-9 April 2014, Ghent, Belgium.
  • IEEE #: CFP14566-CDR
  • ISBN: 9781479947911
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2014 )