Details
- Title: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014)
- Date/Location: Held 7-9 April 2014, Ghent, Belgium.
- Editor: Zhang, G.Q.
- IEEE #: CFP14566-POD
- ISBN: 9781479947898
- Pages: 720 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2014 )
Description
Members/Attendees
Tab 4
- Title: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014)
- Date/Location: Held 7-9 April 2014, Ghent, Belgium.
- Editor: Zhang, G.Q.
- IEEE #: CFP14566-POD
- ISBN: 9781479947898
- Pages: 720 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2014 )