THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. 15TH 2014. (EUROSIME 2014)

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022247
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  • Title: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014)
  • Date/Location: Held 7-9 April 2014, Ghent, Belgium.
  • Editor: Zhang, G.Q.
  • IEEE #: CFP14566-POD
  • ISBN: 9781479947898
  • Pages: 720 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2014 )

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  • Title: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014)
  • Date/Location: Held 7-9 April 2014, Ghent, Belgium.
  • Editor: Zhang, G.Q.
  • IEEE #: CFP14566-POD
  • ISBN: 9781479947898
  • Pages: 720 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2014 )