DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 20TH 2014. (SIITME 2014) (USB)

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024529
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Details

  • Title: 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME 2014)
  • Date/Location: Held 23-26 October 2014, Bucharest, Romania.
  • IEEE #: CFP1407I-USB
  • ISBN: 9781479969616
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2015 )

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Tab 4

 
  • Title: 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME 2014)
  • Date/Location: Held 23-26 October 2014, Bucharest, Romania.
  • IEEE #: CFP1407I-USB
  • ISBN: 9781479969616
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2015 )