DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2014. (DTIP 2014) (CD-ROM)

DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2014. (DTIP 2014) (CD-ROM)

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025619
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  • Title: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2014)
  • Date/Location: Held 1-4 April 2014, Cannes, France.
  • IEEE #: CFP14DTI-CDR
  • ISBN: 9782355000294
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2015 )

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Tab 4

 
  • Title: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2014)
  • Date/Location: Held 1-4 April 2014, Cannes, France.
  • IEEE #: CFP14DTI-CDR
  • ISBN: 9782355000294
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2015 )