Details
- Title: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2014)
- Date/Location: Held 1-4 April 2014, Cannes, France.
- IEEE #: CFP14DTI-POD
- ISBN: 9781479932214
- Pages: 376 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2015 )
Description
Members/Attendees
Tab 4
- Title: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2014)
- Date/Location: Held 1-4 April 2014, Cannes, France.
- IEEE #: CFP14DTI-POD
- ISBN: 9781479932214
- Pages: 376 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2015 )