Details
- Title: 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2015)
- Date/Location: Held 27-30 April 2015, Montpellier, France.
- IEEE #: CFP15DTI-POD
- ISBN: 9781479985456
- Pages: 380 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2015 )
Description
Members/Attendees
Tab 4
- Title: 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2015)
- Date/Location: Held 27-30 April 2015, Montpellier, France.
- IEEE #: CFP15DTI-POD
- ISBN: 9781479985456
- Pages: 380 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2015 )