DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2015. (DTIP 2015) (USB)

DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2015. (DTIP 2015) (USB)

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026970
$121.50 - $243.00
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Details

  • Title: 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2015)
  • Date/Location: Held 27-30 April 2015, Montpellier, France.
  • IEEE #: CFP15DTI-USB
  • ISBN: 9781479986262
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2015 )

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Tab 4

 
  • Title: 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2015)
  • Date/Location: Held 27-30 April 2015, Montpellier, France.
  • IEEE #: CFP15DTI-USB
  • ISBN: 9781479986262
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2015 )