DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 21ST 2015. (SIITME 2015) (USB)

DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 21ST 2015. (SIITME 2015) (USB)

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028613
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Details

  • Title: 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME 2015)
  • Date/Location: Held 22-25 October 2015, Brasov, Romania.
  • IEEE #: CFP1507I-USB
  • ISBN: 9781509003310
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2016 )

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Tab 4

 
  • Title: 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME 2015)
  • Date/Location: Held 22-25 October 2015, Brasov, Romania.
  • IEEE #: CFP1507I-USB
  • ISBN: 9781509003310
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2016 )