Details
- Title: 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2016)
- Date/Location: Held 30 May - 2 June 2016, Budapest, Hungary.
- IEEE #: CFP16DTI-POD
- ISBN: 9781509013913
- Pages: 329 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2016 )
Description
Members/Attendees
Tab 4
- Title: 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2016)
- Date/Location: Held 30 May - 2 June 2016, Budapest, Hungary.
- IEEE #: CFP16DTI-POD
- ISBN: 9781509013913
- Pages: 329 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2016 )