DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2016. (DTIP 2016) (USB)

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031068
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Details

  • Title: 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2016)
  • Date/Location: Held 30 May - 2 June 2016, Budapest, Hungary.
  • IEEE #: CFP16DTI-USB
  • ISBN: 9781509014583
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2016 )

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Tab 4

 
  • Title: 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2016)
  • Date/Location: Held 30 May - 2 June 2016, Budapest, Hungary.
  • IEEE #: CFP16DTI-USB
  • ISBN: 9781509014583
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2016 )