Details
- Title: 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME 2016)
- Date/Location: Held 20-23 October 2016, Oradea, Romania.
- IEEE #: CFP1607I-POD
- ISBN: 9781509044467
- Pages: 307 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2017 )
Description
Members/Attendees
Tab 4
- Title: 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME 2016)
- Date/Location: Held 20-23 October 2016, Oradea, Romania.
- IEEE #: CFP1607I-POD
- ISBN: 9781509044467
- Pages: 307 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2017 )