Details
- Title: 2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 2017)
- Date/Location: Held 19-21 April 2017, Yokohama, Japan.
- IEEE #: CFP17COL-POD
- ISBN: 9781538638293
- Pages: 30 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 2017)
- Date/Location: Held 19-21 April 2017, Yokohama, Japan.
- IEEE #: CFP17COL-POD
- ISBN: 9781538638293
- Pages: 30 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2017 )