Details
- Title: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2017)
- Date/Location: Held 18-20 June 2017, Gothenburg, Sweden.
- IEEE #: CFP17M25-POD
- ISBN: 9781538630563
- Pages: 193 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )
Description
Members/Attendees
Tab 4
- Title: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2017)
- Date/Location: Held 18-20 June 2017, Gothenburg, Sweden.
- IEEE #: CFP17M25-POD
- ISBN: 9781538630563
- Pages: 193 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2017 )