PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING 4. (222ND ECS MEETING/PRiME 2012)

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037444
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Details

  • Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 4
  • Subtitle: 222nd ECS Meeting/PRiME 2012
  • Date/Location: Held 7-12 October 2012, Honolulu, Hawaii, USA.
  • Series: ECS Transactions Volume 50 No.32
  • Editor: Kondo, K. et al.
  • ISBN: 9781623320683
  • Pages: 83 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Apr 2018 )

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Tab 4

 
  • Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 4
  • Subtitle: 222nd ECS Meeting/PRiME 2012
  • Date/Location: Held 7-12 October 2012, Honolulu, Hawaii, USA.
  • Series: ECS Transactions Volume 50 No.32
  • Editor: Kondo, K. et al.
  • ISBN: 9781623320683
  • Pages: 83 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Apr 2018 )