Details
- Title: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC 2018)
- Date/Location: Held 17-21 April 2018, Mie, Japan.
- IEEE #: CFP1889U-POD
- ISBN: 9781538648643
- Pages: 584 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC 2018)
- Date/Location: Held 17-21 April 2018, Mie, Japan.
- IEEE #: CFP1889U-POD
- ISBN: 9781538648643
- Pages: 584 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )