Details
- Title: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC 2018)
- Date/Location: Held 17-21 April 2018, Mie, Japan.
- IEEE #: CFP1889U-USB
- ISBN: 9784990218843
- Format: USB
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC 2018)
- Date/Location: Held 17-21 April 2018, Mie, Japan.
- IEEE #: CFP1889U-USB
- ISBN: 9784990218843
- Format: USB
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2018 )