Details
- Title: 2018 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 2018)
- Date/Location: Held 18-20 April 2018, Yokohama, Japan.
- IEEE #: CFP18COL-POD
- ISBN: 9781538661048
- Pages: 33 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 2018)
- Date/Location: Held 18-20 April 2018, Yokohama, Japan.
- IEEE #: CFP18COL-POD
- ISBN: 9781538661048
- Pages: 33 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2018 )