Details
- Title: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2018)
- Date/Location: Held 22-25 May 2018, Roma, Italy.
- IEEE #: CFP18DTI-POD
- ISBN: 9781538662007
- Pages: 285 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2018)
- Date/Location: Held 22-25 May 2018, Roma, Italy.
- IEEE #: CFP18DTI-POD
- ISBN: 9781538662007
- Pages: 285 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2018 )