DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS AND MOEMS. SYMPOSIUM. 2018. (DTIP 2018) (USB)

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039865
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Details

  • Title: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2018)
  • Date/Location: Held 22-25 May 2018, Roma, Italy.
  • IEEE #: CFP18DTI-USB
  • ISBN: 9781538661987
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2018 )

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Tab 4

 
  • Title: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2018)
  • Date/Location: Held 22-25 May 2018, Roma, Italy.
  • IEEE #: CFP18DTI-USB
  • ISBN: 9781538661987
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2018 )