Details
- Title: 2018 International Conference on Big Data and Artificial Intelligence (BDAI 2018)
- Date/Location: Held 22-24 June 2018, Beijing, China.
- IEEE #: CFP18BDC-POD
- ISBN: 9781538661376
- Pages: 133 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2018 )
Description
Members/Attendees
Tab 4
- Title: 2018 International Conference on Big Data and Artificial Intelligence (BDAI 2018)
- Date/Location: Held 22-24 June 2018, Beijing, China.
- IEEE #: CFP18BDC-POD
- ISBN: 9781538661376
- Pages: 133 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2018 )