Details
- Title: 2018 IEEE/ACM International Conference on Technical Debt (TechDebt 2018)
- Date/Location: Held 27 May - 3 June 2018, Gothenburg, Sweden.
- IEEE #: CFP18P50-POD
- ISBN: 9781538661741
- Pages: 143 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )
Description
Members/Attendees
Tab 4
- Title: 2018 IEEE/ACM International Conference on Technical Debt (TechDebt 2018)
- Date/Location: Held 27 May - 3 June 2018, Gothenburg, Sweden.
- IEEE #: CFP18P50-POD
- ISBN: 9781538661741
- Pages: 143 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2019 )