Details
- Title: 2019 IEEE 3rd International Conference on Circuits, Systems and Devices (ICCSD 2019)
- Date/Location: Held 23-25 August 2019, Chengdu, China.
- IEEE #: CFP19U37-POD
- ISBN: 9781728130644
- Pages: 192 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE 3rd International Conference on Circuits, Systems and Devices (ICCSD 2019)
- Date/Location: Held 23-25 August 2019, Chengdu, China.
- IEEE #: CFP19U37-POD
- ISBN: 9781728130644
- Pages: 192 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2019 )