BIOMEDICAL ENGINEERING. INTERNATIONAL CONFERENCE. 2019.

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054440
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Details

  • Title: International Conference on Biomedical Engineering 2019
  • Date/Location: Held 26-27 August 2019, Tanjung Bungah, Malaysia.
  • Series: Journal of Physics: Conference Series Volume 1372
  • Editor: Fook, C. Y. et al.
  • ISBN: 9781713811299
  • Pages: 503 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Jul 2020 )

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  • Title: International Conference on Biomedical Engineering 2019
  • Date/Location: Held 26-27 August 2019, Tanjung Bungah, Malaysia.
  • Series: Journal of Physics: Conference Series Volume 1372
  • Editor: Fook, C. Y. et al.
  • ISBN: 9781713811299
  • Pages: 503 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Jul 2020 )