3D POWER ELECTRONICS INTEGRATION AND MANUFACTURING. INTERNATIONAL SYMPOSIUM. 3RD 2021. (3D-PEIM 2021)

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059958
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Details

  • Title: 2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2021)
  • Date/Location: Held 21-23 June 2021, Osaka, Japan.
  • IEEE #: CFP21G64-POD
  • ISBN: 9781728163178
  • Pages: 37 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2021 )

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  • Title: 2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2021)
  • Date/Location: Held 21-23 June 2021, Osaka, Japan.
  • IEEE #: CFP21G64-POD
  • ISBN: 9781728163178
  • Pages: 37 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2021 )