Conference Proceedings
Home
 > 
Browse by Publisher
 > 
SPIE - International Society for Optics and Photonics
 > 
RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES VIII

RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES VIII

Send a Friend    
RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES VIII
Item #: 43462
Our Price:   
$70.00
Product Description
Title:Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Desc:Proceedings of a meeting held 28-29 January 2009, San Jose, California, USA. At SPIE MOEMS-MEMS: Micro- and Nanofabrication
Series:Proceedings of SPIE Volume 7206
Editor:Kullberg, Richard C.
ISBN:9780819474520
Pages:180 (1 Vol) (approx)
Format:Softcover
Publ:SPIE - International Society for Optics and Photonics
POD Publ:Curran Associates, Inc. ( Feb 2009 )
Related Products
Browse By PublisherShop By Category
Dave A Curran, EzineArticles.com Basic Author