THERMAL INVESTIGATIONS OF ICS AND SYSTEMS. INTERNATIONAL WORKSHOP. 24TH 2018. (THERMINIC 2018)

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042651
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  • Title: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018)
  • Date/Location: Held 26-28 September 2018, Stockholm, Sweden.
  • IEEE #: CFP18TII-POD
  • ISBN: 9781538667606
  • Pages: 328 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2019 )

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  • Title: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018)
  • Date/Location: Held 26-28 September 2018, Stockholm, Sweden.
  • IEEE #: CFP18TII-POD
  • ISBN: 9781538667606
  • Pages: 328 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2019 )