Details
- Title: 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
- Date/Location: Held 15-17 March 2006, Atlanta, Georgia.
- IEEE #: CFP06MPP-POD
- ISBN: 9781424402601
- Pages: 199 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2007 )
Description
Members/Attendees
Tab 4
- Title: 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
- Date/Location: Held 15-17 March 2006, Atlanta, Georgia.
- IEEE #: CFP06MPP-POD
- ISBN: 9781424402601
- Pages: 199 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2007 )