 Title: | 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces | Desc: | Proceedings of a meeting held 15-17 March 2006, Atlanta, Georgia.
| Prod#: | CFP06MPP-POD | ISBN: | 9781424402601 | Pages: | 199 (1 Vol) | Format: | Softcover | Notes: | Authorized distributor of all IEEE proceedings | TOC: | View Table of Contents | Publ: | Institute of Electrical and Electronics Engineers ( IEEE ) | POD Publ: | Curran Associates, Inc. ( Mar 2007 ) |
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