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ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES. INTERNATIONAL SYMPOSIUM AND EXHIBITION. 11TH 2006.

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Title:2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Desc:Proceedings of a meeting held 15-17 March 2006, Atlanta, Georgia.
Sponsor: Institute of Electrical and Electronics Engineers ( IEEE )
Prod #: CFP06MPP-PRT
ISBN: 9781424402601
Pages:199 (1 Vol)
Format: Softcover
Publisher: Institute of Electrical and Electronics Engineers ( IEEE )
 
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