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ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES. INTERNATIONAL SYMPOSIUM AND EXHIBITION. 11TH 2006.

ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES. INTERNATIONAL SYMPOSIUM AND EXHIBITION. 11TH 2006.

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ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES. INTERNATIONAL SYMPOSIUM AND EXHIBITION. 11TH 2006.
Item #: 00674
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Product Description
Title:2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Desc:Proceedings of a meeting held 15-17 March 2006, Atlanta, Georgia.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP06MPP-POD
ISBN:9781424402601
Pages:199 (1 Vol)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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