ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES. INTERNATIONAL SYMPOSIUM AND EXHIBITION. 11TH 2006.

Item #: 00674

Our Price:

$207.00

Pricing: IEEE Member # :

Title:	2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Desc:	Proceedings of a meeting held 15-17 March 2006, Atlanta, Georgia.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP06MPP-POD
ISBN:	9781424402601
Pages:	199 (1 Vol)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents