Details
- Title: 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
- Date/Location: Held 3-5 October 2007, San Jose, California.
- IEEE #: CFP07MPP-POD
- ISBN: 9781424413379
- Pages: 130 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2008 )
Description
Members/Attendees
Tab 4
- Title: 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
- Date/Location: Held 3-5 October 2007, San Jose, California.
- IEEE #: CFP07MPP-POD
- ISBN: 9781424413379
- Pages: 130 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2008 )