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ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES, AND INTERFACES. INTERNATIONAL SYMPOSIUM. 12TH 2007.

ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES, AND INTERFACES. INTERNATIONAL SYMPOSIUM. 12TH 2007.

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ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES, AND INTERFACES. INTERNATIONAL SYMPOSIUM. 12TH 2007.
Item #: 02655
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Product Description
Title:2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
Desc:Proceedings of a meeting held 3-5 October 2007, San Jose, California.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP07MPP-POD
ISBN:9781424413379
Pages:130 (1 Vol)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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