ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES, AND INTERFACES. INTERNATIONAL SYMPOSIUM. 12TH 2007.

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Title:	2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces
Desc:	Proceedings of a meeting held 3-5 October 2007, San Jose, California.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP07MPP-PRT
ISBN:	9781424413379
Pages:	130 (1 Vol)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents