Details
- Title: 2006 International Conference on Electronic Materials and Packaging
- Date/Location: Held 11-14 December 2006, Kowloon, China.
- IEEE #: CFP06506-POD
- ISBN: 9781424408337
- Pages: 1,143 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2008 )
Description
Members/Attendees
Tab 4
- Title: 2006 International Conference on Electronic Materials and Packaging
- Date/Location: Held 11-14 December 2006, Kowloon, China.
- IEEE #: CFP06506-POD
- ISBN: 9781424408337
- Pages: 1,143 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2008 )