Details
- Title: 2007 International Conference on Electronic Materials and Packaging
- Date/Location: Held 19-22 November 2007, Daejeon, Korea.
- IEEE #: CFP07506-POD
- ISBN: 9781424419098
- Pages: 498 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2008 )
Description
Members/Attendees
Tab 4
- Title: 2007 International Conference on Electronic Materials and Packaging
- Date/Location: Held 19-22 November 2007, Daejeon, Korea.
- IEEE #: CFP07506-POD
- ISBN: 9781424419098
- Pages: 498 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2008 )