THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 11TH 2008. (3 VOLS)

THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 11TH 2008. (3 VOLS)

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003164
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  • Title: 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
  • Date/Location: Held 28-31 May 2008, Orlando, Florida.
  • IEEE #: CFP08ITH-POD
  • ISBN: 9781424417001
  • Pages: 1,282 (3 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2008 )

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  • Title: 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
  • Date/Location: Held 28-31 May 2008, Orlando, Florida.
  • IEEE #: CFP08ITH-POD
  • ISBN: 9781424417001
  • Pages: 1,282 (3 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2008 )