Details
- Title: 2008 International Workshop on Junction Technology
- Date/Location: Held 15-16 May 2008, Shanghai, China.
- Editor: Jiang, Y-L.
- IEEE #: CFP08796-POD
- ISBN: 9781424417377
- Pages: 217 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2008 )
Description
Members/Attendees
Tab 4
- Title: 2008 International Workshop on Junction Technology
- Date/Location: Held 15-16 May 2008, Shanghai, China.
- Editor: Jiang, Y-L.
- IEEE #: CFP08796-POD
- ISBN: 9781424417377
- Pages: 217 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2008 )