Details
- Title: 2008 International Conference on Electronic Packaging Technology & High Density Packaging
- Date/Location: Held 28-31 July 2008, Shanghai, China.
- Editor: Bi, K.
- IEEE #: CFP08553-POD
- ISBN: 9781424427390
- Pages: 1,095 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2008 )
Description
Members/Attendees
Tab 4
- Title: 2008 International Conference on Electronic Packaging Technology & High Density Packaging
- Date/Location: Held 28-31 July 2008, Shanghai, China.
- Editor: Bi, K.
- IEEE #: CFP08553-POD
- ISBN: 9781424427390
- Pages: 1,095 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2008 )