ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2008. (2 VOLS)

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Title:	2008 International Conference on Electronic Packaging Technology & High Density Packaging
Desc:	Proceedings of a meeting held 28-31 July 2008, Shanghai, China.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP08553-PRT
ISBN:	9781424427390
Pages:	1,095 (2 Vols)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents