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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2008. (2 VOLS)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2008. (2 VOLS)

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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 2008. (2 VOLS)
Item #: 03476
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Product Description
Title:2008 International Conference on Electronic Packaging Technology & High Density Packaging
Desc:Proceedings of a meeting held 28-31 July 2008, Shanghai, China.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP08553-POD
ISBN:9781424427390
Pages:1,095 (2 Vols)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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