Details
- Title: 2008 15th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
- Date/Location: Held 7-11 July 2008, Singapore.
- Editor: Gan, C.
- IEEE #: CFP08777-POD
- ISBN: 9781424420391
- Pages: 342 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2008 )
Description
Members/Attendees
Tab 4
- Title: 2008 15th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
- Date/Location: Held 7-11 July 2008, Singapore.
- Editor: Gan, C.
- IEEE #: CFP08777-POD
- ISBN: 9781424420391
- Pages: 342 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2008 )