Details
- Title: 2008 IEEE International Symposium on Electromagnetic Compatibility
- Date/Location: Held 18-22 August 2008, Detroit, Michigan.
- IEEE #: CFP08EMC-POD
- ISBN: 9781424416998
- Pages: 1,597 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2009 )
Description
Members/Attendees
Tab 4
- Title: 2008 IEEE International Symposium on Electromagnetic Compatibility
- Date/Location: Held 18-22 August 2008, Detroit, Michigan.
- IEEE #: CFP08EMC-POD
- ISBN: 9781424416998
- Pages: 1,597 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2009 )