Details
- Title: 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
- Date/Location: Held 9-11 April 2008, Nice, France.
- Editor: Bright, V.M.
- IEEE #: CFP08DTI-POD
- ISBN: 9781424438266
- Pages: 392 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2009 )
Description
Members/Attendees
Tab 4
- Title: 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
- Date/Location: Held 9-11 April 2008, Nice, France.
- Editor: Bright, V.M.
- IEEE #: CFP08DTI-POD
- ISBN: 9781424438266
- Pages: 392 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2009 )