Details
- Title: 2008 International Conference on Electronic Materials and Packaging (EMAP 2008)
- Date/Location: Held 22-24 October 2008, Taipei, Taiwan.
- IEEE #: CFP08506-POD
- ISBN: 9781424436200
- Pages: 317 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2009 )
Description
Members/Attendees
Tab 4
- Title: 2008 International Conference on Electronic Materials and Packaging (EMAP 2008)
- Date/Location: Held 22-24 October 2008, Taipei, Taiwan.
- IEEE #: CFP08506-POD
- ISBN: 9781424436200
- Pages: 317 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2009 )