Details
- Title: 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
- Date/Location: Held 1-3 April 2009, Rome, Italy.
- IEEE #: CFP09DTI-POD
- ISBN: 9781424438747
- Pages: 424 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2009 )
Description
Members/Attendees
Tab 4
- Title: 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
- Date/Location: Held 1-3 April 2009, Rome, Italy.
- IEEE #: CFP09DTI-POD
- ISBN: 9781424438747
- Pages: 424 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2009 )