THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.

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005296
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  • Title: 2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
  • Date/Location: Held 26-29 April 2009, Delft, Netherlands.
  • IEEE #: CFP09566-POD
  • ISBN: 9781424441600
  • Pages: 739 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2009 )

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  • Title: 2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
  • Date/Location: Held 26-29 April 2009, Delft, Netherlands.
  • IEEE #: CFP09566-POD
  • ISBN: 9781424441600
  • Pages: 739 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2009 )