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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.

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THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.
Item #: 05296
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Product Description
Title:2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Desc:Proceedings of a meeting held 26-29 April 2009, Delft, Netherlands.
Prod#:CFP09566-POD
ISBN:9781424441600
Pages:739 (1 Vol)
Format:Softcover
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
Publ:Institute of Electrical and Electronics Engineers ( IEEE )
POD Publ:Curran Associates, Inc. ( Jun 2009 )
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