Conference Proceedings
Home
 > 
Browse by Publisher
 > 
Institute of Electrical and Electronics Engineers ( IEEE )
 > 
THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.

Send a Friend    
THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.
Item #: 05296
Our Price:   
$284.00
Pricing: IEEE Member # :
Product Description
Title:2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Desc:Proceedings of a meeting held 26-29 April 2009, Delft, Netherlands.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP09566-POD
ISBN:9781424441600
Pages:739 (1 Vol)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
Related Products
Browse By PublisherShop By Category
Find Us On Facebook
Dave A Curran, EzineArticles.com Basic Author