THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 10TH 2009.

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Title:	2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Desc:	Proceedings of a meeting held 26-29 April 2009, Delft, Netherlands.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP09566-PRT
ISBN:	9781424441600
Pages:	739 (1 Vol)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents