Details
- Title: 2009 International Conference on Biometrics and Kansei Engineering (ICBAKE 2009)
- Date/Location: Held 25-28 June 2009, Cieszyn, Poland.
- IEEE #: CFP0916H-POD
- ISBN: 9781424444250
- Pages: 227 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2009 )
Description
Members/Attendees
Tab 4
- Title: 2009 International Conference on Biometrics and Kansei Engineering (ICBAKE 2009)
- Date/Location: Held 25-28 June 2009, Cieszyn, Poland.
- IEEE #: CFP0916H-POD
- ISBN: 9781424444250
- Pages: 227 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2009 )