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BIOMETRICS AND KANSEI ENGINEERING. INTERNATIONAL CONFERENCE. 2009. (ICBAKE 2009)
BIOMETRICS AND KANSEI ENGINEERING. INTERNATIONAL CONFERENCE. 2009. (ICBAKE 2009)
Item #: 06113
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Title:
2009 International Conference on Biometrics and Kansei Engineering (ICBAKE 2009)
Desc:
Proceedings of a meeting held 25-28 June 2009, Cieszyn, Poland.
Prod#:
CFP0916H-POD
ISBN:
9781424444250
Pages:
227 (1 Vol)
Format:
Softcover
Notes:
Authorized distributor of all IEEE proceedings
TOC:
View Table of Contents
Publ:
Institute of Electrical and Electronics Engineers ( IEEE )
POD Publ:
Curran Associates, Inc. ( Oct 2009 )
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