Details
- Title: 2009 17th International Conference on Advanced Thermal Processing of Semiconductors (RTP 2009)
- Date/Location: Held 29 September - 2 October 2009, Albany, New York, USA.
- IEEE #: CFP09TPS-POD
- ISBN: 9781424438143
- Pages: 216 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2010 )
Description
Members/Attendees
Tab 4
- Title: 2009 17th International Conference on Advanced Thermal Processing of Semiconductors (RTP 2009)
- Date/Location: Held 29 September - 2 October 2009, Albany, New York, USA.
- IEEE #: CFP09TPS-POD
- ISBN: 9781424438143
- Pages: 216 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2010 )