MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 4TH 2009. (IMPACT 2009)

MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 4TH 2009. (IMPACT 2009)

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006973
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Details

  • Title: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009)
  • Date/Location: Held 21-23 October 2009, Taipei, Taiwan.
  • IEEE #: CFP0959B-POD
  • ISBN: 9781424443413
  • Pages: 656 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Mar 2010 )

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  • Title: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009)
  • Date/Location: Held 21-23 October 2009, Taipei, Taiwan.
  • IEEE #: CFP0959B-POD
  • ISBN: 9781424443413
  • Pages: 656 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Mar 2010 )