Details
- Title: 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009)
- Date/Location: Held 2-4 December 2009, Shatin, Hong Kong.
- IEEE #: CFP09EDP-POD
- ISBN: 9781424453504
- Pages: 185 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2010 )
Description
Members/Attendees
Tab 4
- Title: 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009)
- Date/Location: Held 2-4 December 2009, Shatin, Hong Kong.
- IEEE #: CFP09EDP-POD
- ISBN: 9781424453504
- Pages: 185 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2010 )