Details
- Title: 2010 International Symposium on Advanced Packaging Materials: Microtech (APM 2010)
- Date/Location: Held 28 February - 2 March 2010, Cambridge, United Kingdom.
- IEEE #: CFP10MPP-POD
- ISBN: 9781424467563
- Pages: 93 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2010 )
Description
Members/Attendees
Tab 4
- Title: 2010 International Symposium on Advanced Packaging Materials: Microtech (APM 2010)
- Date/Location: Held 28 February - 2 March 2010, Cambridge, United Kingdom.
- IEEE #: CFP10MPP-POD
- ISBN: 9781424467563
- Pages: 93 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2010 )