Details
- Title: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP 2010)
- Date/Location: Held 5-7 May 2010, Seville, Spain.
- Editor: Courtois, B.
- IEEE #: CFP10DTI-POD
- ISBN: 9781424466368
- Pages: 396 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2010 )
Description
Members/Attendees
Tab 4
- Title: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP 2010)
- Date/Location: Held 5-7 May 2010, Seville, Spain.
- Editor: Courtois, B.
- IEEE #: CFP10DTI-POD
- ISBN: 9781424466368
- Pages: 396 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2010 )