DESIGN TEST INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2010. (DTIP 2010)

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Title:	2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP 2010)
Desc:	Proceedings of a meeting held 5-7 May 2010, Seville, Spain.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP10DTI-PRT
ISBN:	9781424466368
Pages:	396 (1 Vol)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents