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DESIGN TEST INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2010. (DTIP 2010)

DESIGN TEST INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2010. (DTIP 2010)

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DESIGN TEST INTEGRATION AND PACKAGING OF MEMS/MOEMS. SYMPOSIUM. 2010. (DTIP 2010)
Item #: 08346
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Product Description
Title:2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP 2010)
Desc:Proceedings of a meeting held 5-7 May 2010, Seville, Spain.
Prod#:CFP10DTI-POD
ISBN:9781424466368
Pages:396 (1 Vol)
Format:Softcover
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
Publ:Institute of Electrical and Electronics Engineers ( IEEE )
POD Publ:Curran Associates, Inc. ( Jul 2010 )
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