ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 11TH 2010. (ICEPT-HDP 2010) (2 VOLS)

Item #:

009320

$215.50 - $431.00

Details

Title: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010)
Date/Location: Held 16-19 August 2010, Xi'an, China.
Editor: Keyun, B.
IEEE #: CFP10553-POD
ISBN: 9781424481408
Pages: 1,430 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Nov 2010 )

Title: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010)
Date/Location: Held 16-19 August 2010, Xi'an, China.
Editor: Keyun, B.
IEEE #: CFP10553-POD
ISBN: 9781424481408
Pages: 1,430 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Nov 2010 )