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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 11TH 2010. (ICEPT-HDP 2010) (2 VOLS)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 11TH 2010. (ICEPT-HDP 2010) (2 VOLS)

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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 11TH 2010. (ICEPT-HDP 2010) (2 VOLS)
Item #: 09320
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$431.00
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Product Description
Title:2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010)
Desc:Proceedings of a meeting held 16-19 August 2010, Xi'an, China.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP10553-POD
ISBN:9781424481408
Pages:1,430 (2 Vols)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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