DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING. IEEE INTERNATIONAL SYMPOSIUM. 16TH 2010. (SIITME 2010)

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009863
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  • Title: 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME 2010)
  • Date/Location: Held 23-26 September 2010, Pitesti, Romania.
  • IEEE #: CFP1007I-POD
  • ISBN: 9781424481231
  • Pages: 306 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2011 )

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  • Title: 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME 2010)
  • Date/Location: Held 23-26 September 2010, Pitesti, Romania.
  • IEEE #: CFP1007I-POD
  • ISBN: 9781424481231
  • Pages: 306 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2011 )