Details
- Title: 2010 IEEE International 3D Systems Integration Conference (3DIC 2010)
- Date/Location: Held 16-18 November 2010, Munich, Germany.
- IEEE #: CFP10DIC-POD
- ISBN: 9781457705267
- Pages: 495 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2011 )
Description
Members/Attendees
Tab 4
- Title: 2010 IEEE International 3D Systems Integration Conference (3DIC 2010)
- Date/Location: Held 16-18 November 2010, Munich, Germany.
- IEEE #: CFP10DIC-POD
- ISBN: 9781457705267
- Pages: 495 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2011 )