THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 12TH 2011. (EUROSIME 2011) (CD-ROM)

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL. 12TH 2011. (EUROSIME 2011) (CD-ROM)

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011486
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Details

  • Title: 2011 12th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011)
  • Date/Location: Held 18-20 April 2011, Linz, Austria.
  • IEEE #: CFP11566-CDR
  • ISBN: 9781457701054
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2011 )

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  • Title: 2011 12th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011)
  • Date/Location: Held 18-20 April 2011, Linz, Austria.
  • IEEE #: CFP11566-CDR
  • ISBN: 9781457701054
  • Format: CD-ROM
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Aug 2011 )