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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (2 VOLS)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (2 VOLS)

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ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (2 VOLS)
Item #: 13133
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Product Description
Title:2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011)
Desc:Proceedings of a meeting held 8-11 August 2011, Shanghai, China.
Sponsor:Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:CFP11553-POD
ISBN:9781457717703
Pages:1,181 (2 Vols)
Format:Softcover
Publisher:Institute of Electrical and Electronics Engineers ( IEEE )
Notes: Authorized distributor of all IEEE proceedings
TOC:View Table of Contents
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