ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (2 VOLS)

ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (2 VOLS)

Item #:
013133
$194.50 - $389.00
Adding to cart… The item has been added

Details

  • Title: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011)
  • Date/Location: Held 8-11 August 2011, Shanghai, China.
  • Editor: Bi, K.
  • IEEE #: CFP11553-POD
  • ISBN: 9781457717703
  • Pages: 1,181 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2012 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011)
  • Date/Location: Held 8-11 August 2011, Shanghai, China.
  • Editor: Bi, K.
  • IEEE #: CFP11553-POD
  • ISBN: 9781457717703
  • Pages: 1,181 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jan 2012 )