ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING. INTERNATIONAL CONFERENCE. 12TH 2011. (ICEPT-HDP 2011) (2 VOLS)

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Title:	2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2011)
Desc:	Proceedings of a meeting held 8-11 August 2011, Shanghai, China.
Sponsor:	Institute of Electrical and Electronics Engineers ( IEEE )
Prod#:	CFP11553-PRT
ISBN:	9781457717703
Pages:	1,181 (2 Vols)
Format:	Softcover
Publisher:	Institute of Electrical and Electronics Engineers ( IEEE )
Notes:	Authorized distributor of all IEEE proceedings
TOC:	View Table of Contents